Vertical DIP-8 to SOIC-8 Adapter – BrownDog 201202

Description

The BrownDog 201202 DIP-8 to SOIC-8 Adapter converts 8-pin DIP package components to the surface mount SOIC-8 footprint.

Features

• Allows for installation of 8-pin DIP through-hole devices to surface mount SOIC-8 footprints
• One footprint for an 8-pin DIP device is on front surface of adapter.
• Header on bottom edge of adapter mounts to a footprint for a surface mount SOIC-8 device.
• Low loss 20 mil minimum trace width
• Available unpopulated, or with one 8-pin DIP socket installed

Specifications

• Board dimensions: 0.400 in. [10.2mm] by 0.500 in. [12.7mm] by 0.031 in. [0.8mm]
• Overall adapter height (from bottom header to top edge of adapter): 0.61 in. [15.5mm]
• Through-hole diameter: 0.035 in. [0.89mm]
• Through-hole grid pattern: 0.100 in. [2.54mm] pitch, 0.300 in. [7.62mm] row spacing
• Header pitch: 0.050 in. [1.27mm]
• PCB manufactured to IPC-6012 Class II standards
• Board material: FR-4 (UL94V-0), Tg 130°C minimum, 1 oz. copper
• Copper surface finish: ENIG
• Black solder mask on both sides of PCB

Datasheet
201202 Datasheet (PDF)